| Del.# | Title | Type | Dissemination Level | Delivery Date | Downloads |
|---|---|---|---|---|---|
| D1.1 | Project hand-book and documentation standards | R | CO | M01 | |
| D1.2 | First interim project activity and management report | R | CO | M10 | |
| D1.3 | First period project activity and management report | R | CO | M19 | |
| D1.4 | Second interim project activity and management report | R | CO | M28 | |
| D1.5 | Second period project activity and management report | R | CO | M36 | |
| D1.6 | Project final report | R | CO | M36 | |
| D2.1 | Definition of reference applications, system designs, and initial set of system specifications of POETICS prototypes and components | R | CO | M06 | |
| D2.2 | Initial set of system level simulations and component specifications | R | CO | M12 | |
| D2.3 | Definition of hybrid integration, assembly and packaging methodologies | R | CO | M12 | |
| D2.4 | Development of algorithms for the calibration, operation and configuration of the optical switch and external cavity laser | R | CO | M19 | |
| D2.5 | Updated set of system level specifications and simulation results | R | CO | M24 | |
| D2.6 | Final definition of integration and packaging methodologies, and blue prints of POETICS modules | R | CO | M32 | |
| D3.1 | Development of 1st generation of InP EML arrays and InP phase sections | R | CO | M14 | |
| D3.2 | Development of tunable, narrow linewidth external cavity laser on TriPleX | R | CO | M16 | |
| D3.3 | Development of 2D PolyBoard motherboard and 3D PolyBoard MCF interposer for direct detection prototypes | R | CO | M18 | |
| D3.4 | Development of 1st generation of 2D TriPleX and 2D PolyBoard motherboards for coherent prototypes | R | CO | M22 | |
| D3.5 | Development of 2nd generation InP EML arrays and InP phase sections | R | CO | M26 | |
| D3.6 | Development of 3D optical switch on PolyBoard | R | CO | M32 | |
| D3.7 | Development of 2nd generation 2D TriPleX and 2D PolyBoard motherboards for coherent prototype | R | CO | M30 | |
| D4.1 | Report on design and fabrication of the MCM PCBs | R | CO | M16 | |
| D4.2 | Report on 1st generation SiGe test ICs | R | CO | M16 | |
| D4.3 | Report on co-design of driving electronics with optoelectronics | R | CO | M20 | |
| D4.4 | Report on 2nd generation SiGe transmitter and receiver ICs | R | CO | M24 | |
| D5.1 | Development of integration and packaging engine for the MCM prototypes | R | CO | M12 | |
| D5.2 | Development of flip-chip bonding process of InP components | R | CO | M20 | |
| D5.3 | Assembly and packaging of 800Gb/s MCM transceiver (Prototype 1) | DEM | CO | M22 | |
| D5.4 | Assembly and packaging of precursor coherent transceiver (Prototype 5) | DEM | CO | M24 | |
| D5.5 | Assembly and packaging of 1.6Tb/s MCM transceiver (Prototype 2) | DEM | CO | M26 | |
| D5.6 | Assembly and packaging of 1.6Tb/s MCM transceiver (Prototype 3) and optical switch (Prototype 4) | DEM | CO | M30 | |
| D5.7 | Assembly and packaging of final coherent transceiver (Prototype 6) | DEM | CO | M31 | |
| D6.1 | Methodology for the experimental evaluation of POETICS prototypes, the testing scenarios and preparation of system test beds | R | CO | M18 | |
| D6.2 | Development of control units for the operation of the tunable external cavity laser and optical switch prototype | R | CO | M22 | |
| D6.3 | Performance evaluation of 800Gb/s (Prototype 1) and 1600Gb/s (Prototype 2) transceiver and precursor 64 Gbaud coherent transceiver (Prototype 5) in lab settings | DEM | CO | M28 | |
| D6.4 | Performance valuation of 1.6Tb/s transceiver (Prototype 3), optical switch (Prototype 4) and final 64 Gbaud coherent transceiver (Prototype 6) in lab settings | DEM | CO | M32 | |
| D6.5 | Evaluation of 1.6Tb/s transceiver (Prototype 2 and 3) and optical switch (Prototype 4) in relevant settings | DEM | CO | M34 | |
| D6.6 | Evaluation of final 64 Gbaud coherent transceiver in a DCI scenario | DEM | CO | M36 | |
| D7.1 | Announcement of POETICS (Preparation of fact-sheet, presentation and press-release) | DEC | PU | M01 | |
| D7.2 | Website availability and set up of social media accounts | DEC | PU | M02 | |
| D7.3 | Data management plan | ORDP | CO | M06 | |
| D7.4 | Promotion video availability | DEC | PU | M09 | |
| D7.5 | First period exploitation plans and project dissemination | R | CO | M21 | |
| D7.6 | Report on applicability and techno-economic analysis of POETICS components, prototypes and systems | R | CO | M24 | |
| D7.7 | Standardisation of POETICS technology, roadmaps and manufacturability plan | R | CO | M30 | |
| D7.8 | Final plan for the use and dissemination of foreground knowledge – Report on the business case of POETICS | R | CO | M36 | |
| D8.1 | NEC - Requirement No. 2 | Ethics | CO | M36 |
POETICS
H2020 Research and Innovation project
DELIVERABLES
Footer
POETICS
“CoPackaging of Terabit direct-detection and coherent Optical Engines and switching circuits in mulTI-Chip moduleS for Datacenter networks and the 5G optical fronthaul”
Call: H2020-ICT-2019-2
Topic: Application driven Photonics components
Type of Action: RIA
EU contribution: € 5.814.568,75
Duration: 48 months
Start date: 01.01.2020
