POETICS project has been conceived with the strategic objective to develop the underlying technology in Europe for the development of MCMs comprising digital switch ASICs and optical interfaces.
The objectives related to the POETICS concept and performance evaluation are mentioned below:
Objective 1│Develop high-speed InP-EML arrays supporting uncooled operation at up to 100 GBaud per lane in the O-band
Rely on EML technology for light generation and modulation in the transmitting part of the Terabit transceivers. The EMLs will be fabricated in the InP platform, having properties in terms of footprint, cost and power consumption that is closer to directly modulated lasers (DMLs), but performance that is closer to Mach-Zehnder modulators (MZMs) in terms of bandwidth and chirp.
Objective 2| Develop flip-chip compatible high-bandwidth InP phase modulators as photonic add-ons for hybrid InP-polymer IQ modulators
Extend the capabilities of PolyBoard platform by the development of flip-chip compatible high-bandwidth InP phase modulators as photonic add-ons to form hybrid IQ modulators.
Objective 3| Develop a cost-effective widely tunable, narrow linewidth external cavity laser based on flip-chip bonding of InP gain chips on TriPleX platform for operation in the C-band
Develop a high-performance laser source in the form of a micro ring resonator based external cavity laser (MRR-ECL), that will combine wide tunability in the C-band with narrow linewidth and high output power.
Objective 4| Develop 2D and 3D PolyBoard motherboards to host the EML arrays and a 3D Benes optical switching circuit
Optimization of the PolyBoard’s waveguide geometry of operation in the O-band and develop a 2D PolyBoard motherboard to allow efficient low loss coupling of the EML/PD array with the PIC waveguides and for low loss coupling to many Single Mode Fibers. Additionally, a unique 3D PolyBoard will be developed for not only hosting the EML/PD arrays but for providing multiplexing and demultiplexing functionality to an MCF, releasing for the first time a PIC MCF (de)multiplexer for efficient interfacing to MCFs.
Objective 5| Develop TriPleX and PolyBoard PICs and a novel InP flip-chip bonding process to TriPleX and PolyBoard for optical alignment and electrical connection in one step
Develop a novel, high-volume compatible integration method to combine the best circuits from the TriPleX and PolyBoard platforms with InP active elements, forming a set of motherboards for low-cost coherent transceivers.
Objective 6| Assemble 1.6 Tb/s optical engines, co-package them with digital switch ASICs to form Multi-Chip Modules with potential for over 12.8 Tb/s switching capacity, and evaluate their performance
Develop for the first time monolithically integrated SiGe electronic circuits, that will combine in a single die, analog multiplexing and linear amplification functions, for realising high-bandwidth transmitter and receiver electronics for 100 Gbaud operation with PAM-4 modulation format.
Objective 7| Leverage the disruptive potential of the hybrid integration platform: Develop 3D PICs for the interrogation and optical beam scanning unit of Laser Doppler Vibrometers
Bring together the EML technology, the multi-functional high-speed SIGe electronics and the PolyBoard motherboards, to realize novel optical engines with 1.6 Tb/s capacity that will function as the satellite chips of a Multi-Chip Module, built around a digital switch ASIC with potential for over 50 Tb/s capacity.
Objective 8| Package the 32×32 active optical switching circuit with control electronics
Package the optical switching circuit on 3D PolyBoard develop methods (software) and control electronics (hardware) for the operation of the optical switch and the incorporation of the controller ICs on the interposer.
Objective 9| Assemble dual-pol 64 Gbaud coherent transceiver optical engines, co-package them in MCM compatible evaluation boards, and evaluate their performance
Develop the packaging engine for the assembly of TriPleX and PolyBoard circuits described under Objective 5 and incorporate the InP-flip-chip bonding process to realize a dual-pol 64 Gbaud coherent transceiver with tunability in the C-band, narrow-linewidth and polarization diversity.
Objective 10| Prepare solid roadmap and business plan for the commercialization of POETICS MCM technology after the project’s completion
Consolidate a strategy for the commercialization of the MCM transceiver and switching technology project in the post-POETICS era.